BGA-STD-015
Heat Sink, For Ball Grid Array, Standard, 26.5 °C/W, BGA, 14 mm, 10 mm, 14 mm
Brug for flere?
| Antal | |
|---|---|
| 1+ | kr 22,090 |
| 10+ | kr 16,810 |
| 25+ | kr 13,540 |
| 50+ | kr 12,720 |
| 100+ | kr 12,490 |
Produktoplysninger
Produktoversigt
The BGA-STD-015 is a 14mm standard Heat Sink with aluminium, black anodized, thermal tape, 26.5°C/W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.
- 0.27mm Thickness
Applikationer
HVAC
Tekniske specifikationer
26.5°C/W
14mm
14mm
Aluminium
0.39"
-
BGA
10mm
-
0.55"
0.55"
-
Tekniske dokumenter (1)
Lovgivning og miljø
Det land, hvor den sidste væsentlige fremstillingsproces fandt stedOprindelsesland:Great Britain
Det land, hvor den sidste væsentlige fremstillingsproces fandt sted
RoHS
RoHS
Certifikater om produktoverholdelse